JPH0476036U - - Google Patents
Info
- Publication number
- JPH0476036U JPH0476036U JP12020390U JP12020390U JPH0476036U JP H0476036 U JPH0476036 U JP H0476036U JP 12020390 U JP12020390 U JP 12020390U JP 12020390 U JP12020390 U JP 12020390U JP H0476036 U JPH0476036 U JP H0476036U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- cold slag
- clamping body
- support
- supports
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002893 slag Substances 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000005538 encapsulation Methods 0.000 claims 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990120203U JP2511049Y2 (ja) | 1990-11-15 | 1990-11-15 | コ―ルドスラグ除去装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990120203U JP2511049Y2 (ja) | 1990-11-15 | 1990-11-15 | コ―ルドスラグ除去装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0476036U true JPH0476036U (en]) | 1992-07-02 |
| JP2511049Y2 JP2511049Y2 (ja) | 1996-09-18 |
Family
ID=31868122
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990120203U Expired - Lifetime JP2511049Y2 (ja) | 1990-11-15 | 1990-11-15 | コ―ルドスラグ除去装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2511049Y2 (en]) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005183913A (ja) * | 2003-12-15 | 2005-07-07 | Hynix Semiconductor Inc | 半導体パッケージモールディングシステムのカル分離装置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02290031A (ja) * | 1989-04-28 | 1990-11-29 | Nec Corp | 樹脂封止型半導体集積回路のカル及びゲートの除去方法 |
-
1990
- 1990-11-15 JP JP1990120203U patent/JP2511049Y2/ja not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02290031A (ja) * | 1989-04-28 | 1990-11-29 | Nec Corp | 樹脂封止型半導体集積回路のカル及びゲートの除去方法 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005183913A (ja) * | 2003-12-15 | 2005-07-07 | Hynix Semiconductor Inc | 半導体パッケージモールディングシステムのカル分離装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2511049Y2 (ja) | 1996-09-18 |